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Wu-link through the management of suppliers to meet RoHS specifications to obtain the production of raw materials.
產品介紹
Multi-layer Buried&Blind Via PCB
Multi-layer Buried&Blind Via PCB
Laminate: FR-4 1/1oz Surface treatment:
營業項目
Mainly engaged in the PCB circuit board manufacturing services, its main content as a single panel, double panel, multilayer, rigid-flex boards, aluminum panels, to provide soft gold plating, and gold, of silver, lead-free HASL and organic protective film (Organic Solderability Preservative, OSP) PCB surface treatment of different products.